pk 115 (v 1.3 ) september 15 , 2011 www.xilinx.com 1 pk 115 ( v 1.3 ) september 15 , 2011 100% material declaration data sheet ftg256 average weight: 0.7361 g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.020003 2.717 silicon 7440 - 21 - 3 100.00 0.020003 die attach 0.006372 0.866 silver (ag) 7440 - 22 - 4 77.50 0.004938 bismaleimide monomer trade secret 15.00 0.000956 acrylate monomer trade secret 7.50 0.0004 78 mold compound 0.382614 51.980 epoxy resin a trade secret 3.00 0.011478 epoxy resin b trade secret 3.00 0.011478 phenol resin a trade secret 3.00 0.011478 phenol resin b trade secret 3.00 0.011478 metal hydroxide trade secret 1.50 0.005739 carbon black 1333 - 86 - 4 0.30 0.001148 silica fused 60676 - 86 - 0 70.90 0.271273 silica fused 7631 - 86 - 9 15.00 0.057392 silica, crystalline 14808 - 60 - 7 0.30 0.001148 gold wire 0.009626 1.308 gold (au) 7440 - 57 - 5 99.05 0.009534 palladium 7440 - 05 - 3 0.95 0.000091 solder ball 0.124093 16.858 tin (sn) 7440 - 31 - 5 95.50 0.118509 silver (ag) 7440 - 02 - 4 4.00 0.004964 copper (cu) 7440 - 50 - 8 0.50 0.000620 ? copyright 201 1 xilinx, inc. xilinx, the xilinx logo , virtex, spartan, ise, and other designated brands included herein are trademarks of xilinx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet C ftg256 pk 115 (v 1 . 3 ) september 15 , 2011 www.xilinx.com 2 component substance description cas number or descripti on percentage of component use in product component weight/ substance weight (grams) component percent of total substrate 0.193378 26.271 copper (cu) 7440 - 50 - 8 17.68 0.034198 nickel (ni) 7440 - 02 - 0 4.23 0.008174 gold (ag) 7440 - 57 - 5 0.50 0.00 0976 glass fiber 65997 - 17 - 3 16.27 0.031453 non halogen fire retardant 1675 - 54 - 3 0.01 0.000019 bt core 105391 - 33 - 1, 25722 - 66 - 1, 9003 - 36 - 5, 21645 - 51 - 2, 7440 - 38 - 2 46.23 0.089404 solder mask 13676 - 54 - 5, 25722 - 66 - 1, 147 - 14 - 8, 7727 - 43 - 7, 61790 - 5 3 - 2, 14807 - 96 - 6, 461 - 58 - 5, 7723 - 14 - 0 15.08 0.029152
100% material declaration data sheet C ftg256 pk 115 (v 1 . 3 ) september 15 , 2011 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materi als data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of har dware devices to independent third - party vendors and materials suppliers (contractors). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 03 / 21 / 06 1.0 initial xilinx release. 06/19/06 1.1 100% material declaration 09/21/06 1.2 updated component description 09/15/11 1.3 updated component descriptions and w eights
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